JBTSS
jbtss.com
Hands-on field service, in-spec placement accuracy, and a full line of parts for SET flip-chip and device bonders — FC150, FC300 and the ACCµRA line. We also stock parts for SUSS aligners, coaters and cluster systems.
Device bonders are what we do best — decades of hands-on SET experience, from legacy flip-chip tools to current systems. We also stock parts for SUSS lithography equipment.
High-accuracy die placement and bonding for advanced packaging. We handle alignment and calibration, preventive maintenance, repair and parts — keeping your bonder placing in spec.
Don't see your tool? We service more than what's listed — call or text and ask.
Whether your bonder is down right now or you're planning ahead, there's a program built to keep placement on spec and production moving.
After-hours emergency response is available exclusively for customers with an emergency service contract. Contract holders get priority response with parts pulled from in-house stock.
→ Call or text 602.635.7572Scheduled PM that catches placement drift and wear before they cost you yield. Keep your SET bonders running inside spec.
Scheduled visits · per toolPredictable coverage with priority response and budget you can plan around. Purchase orders welcome.
Priority response · POs accepted · Multi-year contracts available with deep discountsHands-on training for operators and engineers on SET bonder operation, process development, and application-specific techniques — on-site or at your facility.
On-site · Per tool or process"To provide unparalleled customer service and the fastest response time by utilizing the most knowledgeable service engineers in the North American market."
Bonder down, or planning a PM schedule? Call, text, or email and reach an engineer directly — not a call center.